This roadmap provides an in-depth analysis of Intel’s current plans for its chip production capacity.
Following the Trump administration’s block on Anthropic’s Mythos 5 and Fable 5 models, world leaders have raised concerns that without direct access to frontier models, they may need to develop their own national alternati…
DeepSeek and CXMT, which have both been tagged as supporting Chinese military and intelligence operations, are set to be added to the U.S.’s Entity List. However, the White House hasn’t included them yet in order to avoid …
Oregon State University researchers have developed a brain-inspired phototransistor that combines light sensing, memory, and signal processing in one device. The hardware can electronically control how long optical memorie…
Nvidia showcases agentic robots that can teach themselves high-precision and dexterous tasks – like PC building – in the real world.
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The US government is seeking dismissal of a lawsuit from the NAACP, arguing that the Colossus 2 data center is crucial for national security. The data center runs the Grok Gov AI model, and the government claims a shutdown…
Intel’s enhanced 18A-P has entered risk production, laying the groundwork to ramp the node into full production in the coming months.
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SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC’s third-gen 7nm at 32.5nm.
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Qualcomm is in talks to buy RISC-V-based AI accelerator and CPU developer Tenstorrent for $8 billion – $10 billion.
TSMC is exploring panel-level packaging and is working on its CoPoS technology, but the company’s Kevin Zhang says wafer-level packaging technologies is considerably more advanced than panel-level packaging.
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