SEM-Guided Low-kV FIB Finishing for Leading-Edge Semiconductor Failure Analysis
SEM-Guided Low-kV FIB Finishing for Leading-Edge Semiconductor Failure Analysis

Discover how the ZEISS Crossbeam 750 FIBSEM sets a new benchmark for precise TEM lamella prep, tomography, and advanced nanofabrication. This delivers better resolution, better SNR, larger usable FOV, and shorter acquisition times. Learn how uninterru…

Intel kicks off development on next-decade 10A and 7A process technologies — 14A node remains on track for critical October PDK release

Intel says its 14A process technology is on track for high-volume manufacturing in 2029, 10A and 7A to follow in the 2030s.

SMIC founder and AMEC CEO urge Chinese fabs to test domestic chipmaking tools on active production lines — equipment makers post record revenue but falling margins

China’s semiconductor equipment vendors collectively posted record revenues in 2025, but profitability is under pressure from domestic price competition.

Russia’s Mikron is selling framed test wafers with up to 120,000 processors as souvenirs — 12 designs, priced around $170 each, sold alongside $2 vials of cleanroom air

Russia’s Mikron is earning a bit of cash on the side by selling picture-framed test wafers as souvenirs with 12 designs to choose from, priced around $170.

Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond

All three leading foundries have now entered the 2nm era, but their paths from now on diverge sharply: TSMC bets on predictability, Intel wagers on aggressive architectural shifts, and Samsung’s primary focus is on improvi…

Accelerating Chipmaking Innovation for the Energy-Efficient AI Era
Accelerating Chipmaking Innovation for the Energy-Efficient AI Era

This sponsored article is brought to you by Applied Materials.At pivotal moments in history, progress has required more than individual brilliance. The most consequential breakthroughs — such as those achieved under the Human Genome Project — required…

TSMC allocates $20 billion to Arizona expansion — project faces water and labor shortages, complicated by visa rules

TSMC’s Fab 21 becomes profitable in the first year of operations, though TSMC continues to struggle with labor shortage, water shortage, and is concerned about the long-term power supply. Nevertheless, it allocates $20 bil…

NASA partners with Microchip to build next-generation spaceflight chips with 100x the power of current offerings — chip designed to withstand radiation for extended missions on the Moon and Mars

The public-private partnership aims to develop an SoC that offers 100x the computing power of current chips designed for spaceflight. NASA envisions that the technologies developed from this project will also be widely imp…

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel’s 2.5D EMIB for HBM integration

The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel’s EMIB technology.